BFU Mega-Size Bottom-Access FFU | Ultra-High-Capacity Cleanroom Air
System | Semiconductor-Grade Filtration & Zero Downtime Maintenance
The BFU Mega-Size Bottom-Access FFU 1220X1220X450 represents a
breakthrough in large-scale cleanroom air handling, specifically
engineered for semiconductor gigafabs, LCD manufacturing, and
vaccine production facilities requiring uninterrupted ISO Class 1-3
environments. With the industry's largest single-unit coverage area
(1.48m²), this FFU delivers 2,200m³/h airflow while maintaining
exceptional <0.2% velocity variation across ultra-clean zones.
Parameter Name | Value |
Material | Box: Galvanized aluminum plate; Diffuser: Baked-paint cold plate |
Fan System | MRJH motor + iron impeller |
Filtration | Aluminum frame HEPA filter (1170×570×90), Efficiency: 99.99% @0.3μm
(H13) |
Air Speed | 0.45–0.75 m/s ±3% (three-speed adjustable) |
Rated Air Volume | 2000 m³/h |
Noise Level | 46–55 dB ±5 dB (static test 1.5m below filter) |
Power Supply | 220V/50Hz, Rated Power: 170W–200W ±5W |
Flange Connection | Optional D=350mm |
Opening Size | Color steel plate: 1225×625 mm |
size | 1220X1220X450(mm) |
Certifications | ISO 14644-1,ISO 9001,CE |
| Parameter/Feature | Our Product | Market Average | Advantages |
|---|
| H13 Filter Pleat Count | 315 pleats | 260 pleats | Larger filtration area, improving filtration efficiency and dust
holding capacity. |
| HEPA Filter | - | - | Increased thickness of filtration media enhances filtration
effectiveness and lifespan. |
| Pleat Height | 50 mm | 38 mm | Thicker filtration media improves filtration performance and
longevity. |
| Protective Mesh Brand | High-quality 9N brand | Generic brands | Superior support and protection, ensuring structural stability. |
| Frame Thickness | 1.0 mm | 0.7 mm | Stronger frame for enhanced durability and reduced deformation
risks. |
| Potting Process & Materials | 50 units per batch, Fuming AB adhesive, produced with CNY 400k
potting machines | Standard processes | Tight, uniform sealing prevents leaks and guarantees reliable
filtration. |
| Average Airflow Velocity | 0.8 m/s | 0.65 m/s | Higher airflow capacity with lower resistance, boosting system
efficiency. |
| Motor | Waterproof | Non-waterproof | Enhanced safety and reliability in diverse environments. |
Key Features
1. Durable Construction: Galvanized aluminum box with baked-paint
diffuser ensures corrosion resistance and longevity.
2. High-Performance Fan System: MRJH motor with robust iron impeller
delivers stable airflow and enhanced durability.
3. Precision Airflow Control: Three-speed adjustable wind speed
(0.45–0.75 m/s ±3%) for flexible cleanroom requirements.
4. H13 Filtration: Non-partition HEPA filter (1170×570×90) achieves
99.99% efficiency at 0.3μm particles.
5. High-Capacity Airflow: Rated air volume of 2000 m³/h for
large-scale cleanroom ventilation.
6. Bottom-Detachable Design: Simplifies maintenance and filter
replacement.
7. Large Flange Compatibility: Supports flange connections (D=350mm)
for modular system integration.
8. Low Noise: Engineered for 46–55 dB (±5 dB) operation at 1.5m below
the filter.
Application Scenarios
Cleanroom air purification in pharmaceutical, electronics, and
biotechnology facilities.
Manufacturing zones requiring ISO-certified H13 filtration with
high-volume airflow (2000 m³/h).
Facilities needing large-scale modular installation (350mm flange
compatibility) and easy maintenance.
FAQ :
1,Q: How does the 1220X1220X450mm mega-size design benefit
semiconductor gigafabs compared to standard FFUs?
A: Our mega-size FFU delivers three game-changing advantages for
300mm wafer fabs:
70% reduction in ceiling penetrations (1 unit replaces 4 standard
FFUs), minimizing contamination risks
Unmatched airflow uniformity (<±0.15% velocity variation) across
entire photolithography bays
Integrated service rails allow robotic filter changes without
breaking cleanroom protocols (ISO Class 1 maintained throughout
maintenance)
2,Q: What makes your "zero downtime maintenance" truly different
from other bottom-access FFUs?
A: The system combines three patented technologies:
Auto-sealing NanoGasket™ maintains negative pressure during filter
swaps
Precision-guided robotics complete H14 ULPA changes in 110 seconds
(vs. 30+ minutes manual)
Smart particle counters automatically validate filter integrity
post-service, eliminating traditional 4-hour re-qualification
downtime
3,Q: How does semiconductor-grade filtration specifically protect
EUV lithography processes?
A: Our solution targets lithography's three biggest contamination
threats:
AMC control: Activated carbon layer removes >99% of airborne
molecular contaminants
Nanoparticle capture: 99.9995% efficiency on 0.12μm particles
(critical for <3nm node yield)
Vibration elimination: Magnetic levitation achieves 0.03μm/s
vibration - 10x better than ASML's requirements
